| 摘要 |
PURPOSE:To prevent the charging of a surface protective film by forming an aluminum thin-film shaped to the upper section of the surface protective film being formed, coating a semiconductor device shaped to a semiconductor substrate and connected to said semiconductor substrate. CONSTITUTION:A silicon substrate 3, a surface protective film 4 formed, coating the surface of a semiconductor device shaped to the silicon substrate 3 and an aluminum thin-film 6 formed to the upper section of the surface protective film 4 and connected to the exposed surfaces of the silicon substrates 3 on the outer circumferences of chips and a bonding pad 7 for grounding are included. According to such constitution, the whole semiconductor device is wrapped with a conductor, thus preventing the charging of the surface protective film 4.
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