| 摘要 |
PURPOSE:To improve handling properties at the time of mounting and dismantling by forming a contacting section being brought into contact with respective input/output pin for an integrated circuit on mounting to said integrated circuit and bringing sections among said each input/output pin to a conductive state and releasing contacts with said respective input/output pin of said contacting section by inserting said integrated circuit to a substrate. CONSTITUTION:An electrostatic breakdown preventive sheet 1 is applied for a large scale integrated circuit LSI having grid array type pin array, a blank consists of a conductive rubber, and holes 2 are bored in conformity with the pin array of the LSI fitted. Contacts 3 are projected to the holes 2, contact ends 4 are protruded toward the centers of the holes 2 in the contacts 3, and protruding sections 5 are projected toward the direction of the base. All pins of the LSI are conducted by the contact ends 4 on setting up to the LSI, and the protruding sections 5 are pushed up by a printed board 8 and the contact ends 4 are separated from the pins 7 when the LSI is mounted to the printed board 8 under the state, thus releasing a conductive state. Accordingly, electrostatic breakdown at the time of mounting and dismantling can be prevented.
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