CONNECTION OF SEMICONDUCTOR MATERIAL AND APPLICABLE CONNECTING MATERIAL

摘要

PURPOSE:To simplify the electrical connection process such as package etc. for increasing the working efficiency and connecting strength between a lead wire and a chip by a method wherein a connecting material is formed by means of coating an amorphous alloy made core wire with other metal. CONSTITUTION:A lead wire 2 is provided on the surface of a substrate 1 while a semiconductor material 3 is mounted on the central part of substrate 1 through the intermediary of a bump electrode 7a to be electrically connected to the lead wire 2. An electric torch 6 is approached to the end of a wire 5 inserted into a capillary 4 of a wirebonder with the surface of amorphous alloy made ultrafine core wire 5a of the wire 5 coated with a metallic layer 5b to form a ball 7. The amorphous phase at the root of ball 7 is to be a low temperature region affected by the glassmaking temperature subject to the structurally loosening phenomenon. Through these procedures, the electrode 7a is bonded onto an inner wiring 3a provided on the surface of connecting material 3 to electrically connect the lead wire 2 to the wiring 3a while fixing the material 3.