发明名称 Photocurable resin composition having excellent adhesion to the surface of a substrate
摘要 A photocurable composition comprising (a) 100 parts by weight of a resin having structural units derived from at least one alpha, beta-unsaturated ethylenically unsaturated monomer, (b) 10 to 300 parts by weight of a photopolymerizable monomer, (c) 0.1 to 20 parts by weight of a photopolymerization initiator, and (d) 0.01 to 1 part by weight of a compound represented by the following general formula (I) or general formula (II) <IMAGE> (I) <IMAGE> (II) wherein R1 represents a divalent aromatic hydrocarbon group having bonds at the ortho-position to each other; R2 represents hydrogen, an alkyl group having 1 to 4 carbon atoms, a phenyl group or an aryl group having a C1-C4 alkyl; R3 and R4 each represent an alkyl group having 1 to 10 carbon atoms, an aryl group or an aralkyl group; X1 represents oxygen, sulfur or N-R5; X2 represents oxygen, sulfur or NH; X3 represents nitrogen or CR6; X4 represents oxygen, sulfur or NR6; X5 represents nitrogen or CR7; X6 represents nitrogen or CH; R5 represents hydrogen, a hydroxyl group, halogen or an alkyl group having 1 to 4 carbon atoms; R6 represents hydrogen or an alkyl group having 1 to 4 carbon atoms; and R7 represents hydrogen, NH2, halogen or an alkyl group having 1 to 4 carbon atoms.
申请公布号 US4756994(A) 申请公布日期 1988.07.12
申请号 US19860871759 申请日期 1986.06.06
申请人 SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 ARAKI, YASUHIKO;DANJO, SHIGERU;SHOHI, HAJIME
分类号 G03F7/085;H05K3/00;H05K3/06;H05K3/38;(IPC1-7):G03C1/94;G03C1/68 主分类号 G03F7/085
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