| 摘要 |
PURPOSE:To assure the accurate bonding process for mounting a chip by a method wherein the rear surface of a metallic foil within a device hole part is reinforced with high heat resistant resin to prevent metallic leads from being disordered. CONSTITUTION:A metallic foil 14 is bonded onto a film substrate 12 using a bonding agent 13 to form a film carrier 15. Then, the rear surface of a device hole 12a reinforced with high heat resistant resin 16 is coated, exposed and etch-processed with sensing resist to make metallic leads 14a with no entering owing to the resin 16. Through these procedures, a chip 10 with electrode terminals 11 to be mounted can be bonded to metallic bumps 19 such as Au bumps without fail using a bonding tool 20.
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