| 摘要 |
PURPOSE:To minimize steps and to uniformize the film thickness of a photoresist pattern so that a prescribed taper shape is stably obtd. by forming a dummy pattern consisting of a photosensitive resin to the bottom in the step part of a polyimide resin film. CONSTITUTION:A dummy pattern 6 is used by utilizing a photolithographic technique and using a positive type photoresist to the step part of the insulating layer 4 consisting of the polyimide resin in such a manner that the height thereof is nearly the same as the height of the polyimide resin on a coil 5. A negative type photoresist 7 is coated by a spinner thereon. Such photoresist 7 is patterned to a prescribed shape by using the photolithographic technique and the insulating layer 4 consisting of the polyimide resin is etched by a soln. mixture composed of hydrazine and ethylene diamine, by which the taper shape is obtd. The photoresist of the dummy pattern 6 is easily dissolved in this case.
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