CHIP CARRIER IC DEVICE

摘要

PURPOSE:To increase the mounting density to a circuit substrate also to be hardly affected by the difference in thermal expansion coefficient by a method wherein all outer connection electrodes are formed on the side in the lamination direction of a multilayered substrate. CONSTITUTION:A chip cover IC device 1 with a multilayered substrate 3 fitted with IC chip 4 as well as with one side in the lamination direction fitted with outer connecting electrodes 7a-7d is fixed on a circuit substrate 8 assuming one side 3a as a junction surface to connect respective electrodes 7a-7d to the wirings of substrate 8.