| 摘要 |
PURPOSE:To obtain the title composition which can give a cured product excellent in moisture resistance, heat resistance and low stress and nonfluctuating in properties irrespectively of curing conditions and is useful as an insulation material for electric and electronic components, by mixing an epoxy resin with a curing agent and a specified silicone resin. CONSTITUTION:A mixture of an epoxy resin (A) having at least two epoxy groups in the molecule [e.g., 2,2-bis(4-hydroxyphenyl)propane] with an epoxy resin curing agent (B) (e.g., methylhexahydrophthalic anhydride) is mixed with 1-15wt.%, preferably, 2-10wt.% based on this mixture, silicone resin (C) of the formula (wherein R1-8 are each methyl or pheyl, 2-6 of these groups are methyl groups and the rests (2-6) of these groups are phenyl groups), and optionally, a reactive diluent, a cure accelerator, a filler, a colorant, an antifoam, a mold release, a flow modifier, etc. (D).
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