FORMATION OF POLYAMIDE RESIN COATED FILM

摘要

PURPOSE:To form the title polyamine resin coated film by polymerization without generating gaseous hydrogen chloride by using an aromatic acid dichloride and a silylated diamine as the raw monomers for the polyamide resin at the time of forming the polyamide resin coated film on the surface of a substrate in a vacuum vessel. CONSTITUTION:The substrate 3 to be treated is held by a holder 4 in the vacuum vessel 1, and heated by a heater 5 to a specified temp. Two vaporization vessels 7 and 7 are arranged at the positions opposed to the substrate 3 in the vacuum treating vessel 1. An aromatic dichloride (a) such as terephthalic dichloride as the raw monomer is charged in one vessel 7 and an silylated diamine such as 4-4'-disilylaminophenyl ether as the raw monomer (b) in another vessel 7 in 1/1 molar ratio of a/b. The material (a) is heated to 45+ or -2 deg.C and the material (b) to 100+ or -2 deg.C to vaporize both materials, and the polyamide resin coated film is formed on the surface of the substrate 3 without generating harmful gaseous HCl.