| 摘要 |
<p>PURPOSE:To permit forcible uniformization of the temp. of a substrate with an exposed resist to a specified temp. of imposing said substrate on a heat insulating plate prior to development of the resist. CONSTITUTION:The resist is coated on the main surface of the substrate and is selectively exposed. The substrate with such exposed resist is imposed for the prescribed time on the surface of the heat insulating plate kept uniformly at the specified temp. and the resist pattern is formed by developing the resist. With such resist pattern as a mask, the main surface of the substrate is selectively etched to form a desired pattern on the main surface of the substrate and thereafter, the resist pattern stripped. All the substrates with the exposed resists are forcibly brought at the specified and uniformized temp. when imposed on the heat insulating plate in such a manner. Generation of intra-surface and inter-surface dispersion is thereby suppressed and the pattern having desired line width are surely and stably formed.</p> |
