| 摘要 |
PURPOSE:To obtain the titled composition useful for sealing light-emitting devices, light-receiving devices, etc., by blending an epoxy resin solid at normal temperatures, trans-cyclohexane-1,2-dicarboxylic anhydride, curing agent and releasant. CONSTITUTION:The objective composition can be obtained by blending (A) an epoxy resin solid at normal temperatures, (B) a trans-cyclohexane-1,2- dicarboxylic anhydride as the acid anhydride curing agent solid at normal temperatures, (C) a curing catalyst, and (D) a releasant. The amount of the component B is pref. such as to be 0.8-1.2 equivalents based on the component A; whereas the amount of the component C 0.1-2pts.wt. per 100pts.wt. of the component B. |
