| 摘要 |
PURPOSE:To prevent the containing of bubbles in a bonding section, and to eliminate the defective breaking, etc., of a semiconductor device by laminating and arranging silicon wafers in a solder melt and forming an silicon-wafer laminate. CONSTITUTION:An silicon-wafer fixture 11 with a cylindrical section having the same circular section as the shapes of silicon wafers 1 is disposed into a solder melt 10 filled into a vessel. The wafers 1 are dipped into the solder melt 10 alternately with spacers 12 while the directions of P-N junctions are arranged, and are disposed into the fixture 11 in succession. When the spacers 12 have the same external shape as the wafers 1, solder thickness required is set among the wafers and the spacers 12 are dipped into the solder melt 10, and the spacers 12 are plated with Ni in order to improve wettability with solder so as not to take in gases on the outside of the solder melt. A group of stacked silicon wafers is pulled up from the inside of the melt 10 together with the fixture 11, and formed to the laminate of the wafers 1. |
