发明名称 APPARATUS FOR TREATING THIN FRAGMENT OF SEMICONDUCTOR
摘要 <p>Apparatus suitable for processing semiconductor slices, the apparatus comprises a tank (1) for receiving a jig carrying semiconductor slices, a first supply line (2) for supplying a processing liquid to the tank (1), a supply valve (3) for controlling liquid supply through the first supply line (2), the supply valve (3) being operable in response to changes in fluid pressure at a control port (4) of the supply valve (3) and a second supply line (5) for supplying fluid to the control port (4) to control operation of the supply valve (3). The second supply line (5) communicates with an inlet (8) of the tank (1) via a control valve (7) which is operable in response to changes within the tank to control the fluid pressure at the control port (4) and so control operation of the supply valve (3). In the arrangement shown in Figure 1, a valve member (7a) of the valve (7) is carried by a platform (9) pivotally mounted within the tank (1). The weight of a jig carrying semiconductor slices acting on the platform (9) causes the platform (9) to tilt to close the control valve (7) thereby increasing the fluid pressure at the control port (4), causing the supply valve to open and so supply liquid to the tank via the inlet (1').</p>
申请公布号 JPS63164437(A) 申请公布日期 1988.07.07
申请号 JP19870317661 申请日期 1987.12.17
申请人 PHILIPS GLOEILAMPENFAB:NV 发明人 YOSEFU BERU TETSUTERINGUTON;UIRIAMU AADEN
分类号 H01L21/304;B08B3/02;H01L21/00;H01L21/306 主分类号 H01L21/304
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