| 摘要 |
1. Natural convection cooling device for vertically aligned electronic or electrical and electronic components (16, 18, 20) having different surface densities of thermal dissipation and mounted in an enveloppe (22) open at its two top and bottom ends, characterized in that the said components are arranged from bottom to top by increasing order of their surface density of thermal dissipation, in that certain amongst them are integrated circuits, in that the surface density of dissipation of the integrated circuits is not the weakest and in that the component having the strongest surface density of thermal dissipation is located at the upper end of the enveloppe (22). |
