| 摘要 |
PURPOSE:To prevent leads from being cut even though a pulling force works on the leads by a method wherein the leads existing in a device hole are each partially formed into a ring shape or an arc shape. CONSTITUTION:Leads 10, which protrude into a device hole provided on a tape 1 and are bonded together with metal protuberances 5 of a semiconductor element 4, respectively have partially a ring-shaped region 11. When a stress is applied to the tape 1 and the device hole 2 is deformed, a pulling force acts on the leads 10 bonded together with the metal protuberances 5 of the element 4 in proportion to the degree of the stress. However, as the leads are each partially formed into a ring shape, the leads, which are each a circular ring- shaped lead 11, are each deformed into the form of a long hole by the pulling force and extended to absorb this force and the cutting of the leads 10 is not generated.
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