| 摘要 |
PURPOSE:To make it possible to prevent occurrence of defects, by providing a brush, which rotates and brushes a material to be treated, and a dust collecting means, which is opened so as to face the brush through the material to be treated and arrests contamination yielded from the brushed material to be treated, thereby ensuring the removal of the contamination attached to the material to be treated. CONSTITUTION:A brush 13a rotates and abrades a material 6 to be treated. A dust collecting means is opened so as to face the brush 13a through the material 6 to be treated and arrests contamination yielded from the material 6 to be treated, which is brushed with the brush 13a. The material 6 to be treated is, e.g., a lead frame. A package is formed together with the lead frame as a unitary body in assembling a semiconductor device. Said contamination removing apparatus 13 is arranged at the previous stage of the cutting and molding works of the lead frame. The lead frame 6 is moved in the direction of the lead cutting part by a conveying pawl 7, which is engaged with the frame, on conveying rails 3. The brush 13a rotated and brushes the lead frame 6. A dust collecting port 3 is provided in a dust collecting box 13c so as to face the brush 13a through the lead frame 6. In this way this apparatus is constituted.
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