| 摘要 |
PURPOSE:To excellently measure high frequency characteristics by pressing the leads of a semiconductor device directly in contact with the electrodes of a substrate as the measurement terminal of a measuring circuit part. CONSTITUTION:The semiconductor device 1 to be measured have its product leads 3 positioned by a lead presser 2 and brought into contact with the electrodes 4. Thus, the product leads 3 are made to contact the electrodes 4 and vibrations are applied by a vibration body 7 for an ultrasonic wave for bringing the product leads 3 and electrodes 4 into excellent contact, thereby removing a surface oxide film. Then the semiconductor device 1 is measured by a substrate 5 and a measuring circuit 6. Consequently, the product leads 3 contact the electrodes 4 of the measuring circuit part 6, so the high frequency characteristics can be measured excellently.
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