METHOD OF MOUNTING A CARRIER FOR A MICROELECTRONIC SILICON CHIP

摘要

A chip carrier (11) is to be mounted on a substrate (13) which includes a thermally conductive layer (14). A hole is formed in an insulating layer (15) to expose the thermally conductive layer (14) and the hole is filled with a thermally conductive material (18). A metallised zone (20) of the carrier overlays the material (18) and is soldered thereto with the same solder as is used to make electrical connections (12, 17, 19) to the carrier (11).