Encapsulated semiconductor device.

摘要

This invention provides a semiconductor device comprising a die-pad (2) supported by tie-bars (1), a semiconductor element (3) mounted in the die-pad (2) with the die-pad (2), tie-bars (1) and semiconductor element (3) being encapsulated in a moulding compound (6), wherein at least one aperture (6a) or cut-away (6b) extends in to the moulding compound (6) so as to expose a portion of a tie-bar (1).