发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:To make it possible to form a thermosetting resin composition excellent in adhesiveness and heat resistance and showing long-term storage stability without causing blocking during storage, by mixing a polyepoxy compound with an adduct of a specified compound with an isocyanate compound. CONSTITUTION:This thermosetting resin composition contains at least a polyepoxy compound [A] and an adduct [B] of 1,8-diazabicyclo(5,4,0)undecene-7 with an isocyanate compound and/or an adduct [C] of 1,5-diazabicyclo(4,3,0) nonene-5 with an isocyanate compound. When a polyisocyanate compound is further added to the above composition, the effect can be further improved.
申请公布号 JPS63162718(A) 申请公布日期 1988.07.06
申请号 JP19860308473 申请日期 1986.12.26
申请人 HITACHI LTD 发明人 NISHIKAWA AKIO
分类号 C08G18/58;C08G18/78;C08G18/79 主分类号 C08G18/58
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