| 摘要 |
PURPOSE:To improve the adhesion of a ceramic coat to electrolytic copper foil, by electrodepositing fine particles on the roughened surface of the foil to make the surface finely uneven and by plasma-spraying ceramics on the uneven surface. CONSTITUTION:The surface of electrolytic copper foil is roughened and fine particles of copper, a copper compd. or a copper alloy are electrodeposited on the roughened surface to make the surface finely uneven. A ceramic layer is then formed on the uneven surface by plasma-spraying ceramics such as alumina. Thus, ceramic coated copper foil whose ceramic coat has superior adhesion to the base copper foil is obtd. The ceramic coated copper foil can be used as a material for a printed circuit board or the like.
|
