| 发明名称 |
Controlled collapse thermocompression gang bonding |
| 摘要 |
Controlled shape bumps are fabricated into the metal contact fingers that are to be used in the gang bonding assembly of semiconductor devices. The bump shape permits the gang bonding of a plurality of contact fingers simultaneously while producing reliable, uniformly high strength bonds.
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| 申请公布号 |
US4754912(A) |
申请公布日期 |
1988.07.05 |
| 申请号 |
US19870122486 |
申请日期 |
1987.11.16 |
| 申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
BURNS, CARMEN D. |
| 分类号 |
H01L21/603;H01L23/495;(IPC1-7):H01L21/58 |
主分类号 |
H01L21/603 |
| 代理机构 |
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