发明名称 RESIN MOLDING APPARATUS
摘要 PURPOSE:To obtain a product where the thickness of a sealing resin is uniform and at the same time to prevent burrs on the rear face of a base plate from occurence, by providing a hole connected with a cavity in a part of a top force or a bottom force and connecting this hole with a vacuum adsorption apparatus. CONSTITUTION:An outer vacuum apparatus is connected with an outer hole 11 of a bottom force, and the vacuum apparatus is operated after a base plate 6 is placed on a cavity of the mold. The warpage of the base plate which has warpage can be thereby rectified as shown with a continuous line by means of the vacuum operation. A resin is thereafter poured and sealed in the same way as an ordinary mold. By the above described operation, the same product as that obtained in the case where sealing is done on a flat base plate. As the base plate 6 is adsorbed on the bottom of the cavity in this case, the resin can not penetrate between the base plate and the cavity and burrs are hardly generated.
申请公布号 JPS63162206(A) 申请公布日期 1988.07.05
申请号 JP19860315092 申请日期 1986.12.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 UEDA TETSUYA
分类号 B29C39/10;B29C39/26;B29C39/42;B29K105/20;B29L31/34;H01L21/56 主分类号 B29C39/10
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