摘要 |
PURPOSE:To carry out a production of many types and in a small quantity with low cost and good productivity, by fixing a mold for a mold cavity, a mold for moving a hard pin, a mold for a hard pin on a die set, and thereby forming a cavity for a molding of a plasticmolded printed circuit board. CONSTITUTION:As a mold for preparing a molding, a die set for injection molding constituted of a fixed side metal mold plate for forming a molten resin introducing part and a space for setting a mold part, a stripper metal mold plate having a molten resin introducing part connected thereto and forming a space for setting a mold part, and a movable metal mold plate forming a space for setting a mold part, is used. If required, a pair of mold prepared of a cured resin composition constituted of a mold I where a hole for receiving the hard pin for forming a hole of the plastic molding and a retreated part for a cavity are formed, and a mold II where a through hole for moving the hard pin for forming a hole and a retreated part for a cavity are formed, and further a mold III for the hard pin where the hard pin for forming a hole is fixed with a curable composition are used. The mold I, II and III are respectively fixed on the fixed side metal mold plate, the stripper metal mold plate and the movable metal mold plate.
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