| 摘要 |
Apparatus for inspecting the coplanarity of surface mounted integrated circuit components including a housing for containing necessary electrical circuitry and indicators, a socket assembly for receiving one electronic circuit package at a time and for contacting each lead of the package that is within acceptable coplanarity limits, and means for indicating those leads that are out of predetermined limits. The device also includes a spring loaded plunger assembly for facilitating insertion of a packaged IC device into the inspection socket and for applying appropriate loading force to the top surface thereof.
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