发明名称 SEMICONDUCTOR PACKAGE COOLING DEVICE
摘要 PURPOSE:To upgrade cooling efficiency, by linking a coolant discharge pipe with an suction means on a free end positioned opposite to a cooling body side so that the coolant flows inside the cooling body from an outside on the periphery of the cooling body and passes through cooling fins. CONSTITUTION:Cooling fins 51 and 52 of a cooling body 40 are disposed on a semiconductor package 21 so that they are linked with an external surface part 22 for heat radiation of the semiconductor package 21. A tube 41 for coolant discharging is incorporated with its one end disposed in a coolant discharge window 83 of the cooling body 40. While the cooling body 40 is disposed in an atmosphere of the coolant 31, the coolant discharge pipe 41 is linked with an suction means on a free end positioned opposite to the cooling body 40 side. The coolant 31 passes from coolant receiving windows 81 and 82 of the cooling body 40 to the cooling fins 51 and 52, and next it flows via their spatial region and passes through the coolant discharge pipe 41.
申请公布号 JPS63161653(A) 申请公布日期 1988.07.05
申请号 JP19860310487 申请日期 1986.12.25
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 SAKAKAWA YOSHIMITSU
分类号 H01L23/473;H01L23/46 主分类号 H01L23/473
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