发明名称 RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To contrive reduction in wear away of a mask by a method wherein a plurality of recessed parts are provided on the surface of a plastic package, and marks are printed on the recessed parts using adhesive marking ink. CONSTITUTION:On the surface of the plastic package to be used as an outer case, recessed parts 201 which are sectioned as many as the largest number of letters expressing a name of several kinds of mold types are provided. Then, a mark 102 is printed in a recessed part 201 using marking ink. As a result, the generation of wearing away of the mark and brake of the mark caused by the foreign brought into contact with the surface of the mark in the process and the like subsequently performed can be reduced.
申请公布号 JPS63160251(A) 申请公布日期 1988.07.04
申请号 JP19860315466 申请日期 1986.12.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 ONO TAKASHI
分类号 H01L23/00;H01L23/28 主分类号 H01L23/00
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