发明名称 RESIN COMPOSITION
摘要 PURPOSE:To obtain a resin composition having excellent impact, crack resistance, toughness such as flexibility, etc., as well as adhesive property to metal and suitable as sealed and molded electronic part articles, etc., by blending a polyarylene sulfide resin with a specific modified polymer and, if necessary, inorganic filler. CONSTITUTION:A resin composition obtained by blending (A) 100pts.wt. polyarylene sulfide having 1-20,000g/10min melt flow rate with (B) 0.1-100pts. wt. modified polymer prepared by reacting (B1) a hydrogenated polymer of a conjugated diene, e.g. hydrogenated polybutadiene, etc., or hydrogenated copolymer of a conjugated diene and aromatic vinyl hydrocarbon, e.g. hydrogenated styrene/butadiene/styrene triblock copolymer, etc., with (B2) glycidyl ester of an alpha,'-unsaturated acid, e.g. glycidyl acrylate, etc., and, if necessary, (C) an inorganic filler, e.g. glass fiber, etc., in an amount of 1-80wt% based on the total composition.
申请公布号 JPS63161057(A) 申请公布日期 1988.07.04
申请号 JP19860307752 申请日期 1986.12.25
申请人 DAINIPPON INK & CHEM INC 发明人 IZUTSU HITOSHI
分类号 C08L15/00;C08L21/00;C08L51/00;C08L51/04;C08L63/00;C08L81/02;C08L81/04 主分类号 C08L15/00
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