发明名称 BINDER FOR PASTE SOLDER
摘要 PURPOSE:To prevent corrosion of solder powder and oxidation of base metals and to improve brazing workability by mixing PE and org. gelling agent respectively at prescribed % with specific wt.% of n-heptane to form the titled binder. CONSTITUTION:The binder for paste solder is obtd. by mixing 40-80% PE, by weight, with 20-60% n-heptane, adding 0.25-3%org. gelling agent further to the mixture, mixing and agitating the mixture and heating the same. The sepn. and corrosion of the solder powder during storage are prevented and the corrosion of the base metals when the solder is coated on the base metals is prevented as well if the paste solder is prepd. by adequately mixing and agitating the solder powder and this binder. The splashing of the binder during brazing and the formation of residue are prevented and, therefore, the brazing workability is improved.
申请公布号 JPS63160788(A) 申请公布日期 1988.07.04
申请号 JP19860314058 申请日期 1986.12.24
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 KASHIWAGI KOZO;YANAGISAWA HIDEKAZU
分类号 B23K35/22;C08K5/01;C08L23/06 主分类号 B23K35/22
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