| 摘要 |
PURPOSE:To improve the reliability of semiconductor element by a method wherein the semiconductor element is sealed with an epoxy resin composition containing denatured epoxy resin or denatured phenolnovolak resin, specified alumina powder and indefinite sized silica powder. CONSTITUTION:A semiconductor element is sealed with an epoxy resin composition. This epoxy composition contains either a reacted product (A) of polydimethlsiloxane having two or more functional groups selected from groups comprising epoxy group, hydroxyl group, carboxyl group, amino group and mercaptan group within a molecular chain and the epoxy resin; or another reacted product (B) with phenol novolak resin; an alumina powder (C) in Wadel spheroidicity of 0.5-1.0; and amorphous silica powder (D). Thus, the resin sealing process with excellent heat dissipation and low stress can be assured to improve the sufficient reliability.
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