| 摘要 |
PURPOSE:To prevent the burrs on lead pins during formation from occuring to be firmly mounted on a circuit substrate etc., by a method wherein the spherical degree is specified and the range of particle diameters is limited for an inorganic filler of an epoxy resin composition. CONSTITUTION:A semiconductor element is cover-molded out of an epoxy resin composition containing an inorganic filler. This inorganic filler contained in the epoxy resin composition is composed of those in Wadel sphoroidicity of 0.7-1.0 with the particle diameter of main component not exceeding 50 mum as well as the distribution of particle sizes not exceeding 5 mum, 5.0-20.0 weight %; 6-10 mum, 5.0-15.0%; and 11-50 mum, 60.0-80.0%. Besides, as for the epoxy resin, novolak epoxy resin equivalent of 150-220 while as for the hardener, novolak phenol resin are applicable. Through these procedures, the burrs on lead pins during formation can be prevented from occurring enabling the lead pins to be firmly mounted on a circuit substrate.
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