| 摘要 |
PURPOSE:To obtain the titled paste outstanding in stress relaxation characteristics preventing ICs from failure, by blending silver powder, epoxy resin, curing agent and, as the flexibilizer, dimethylsiloxane compound carrying epoxy group, etc., in specified proportions. CONSTITUTION:The objective paste can be obtained by blending (A) silver powder, (B) an epoxy resin (C) a curing agent, and (D) as the flexibilizer, a dimethylsiloxane compound carrying epoxy, amino, or alcohol group in such weight ratios as A/(B+C+D)=60/40-90/10 and D/(B+C)=0.5/100-20/100. This paste is suitable for bonding large-sized chips to copper frame, being excellent in stress relaxation characteristics preventing ICs from failure caused by chip crack and/or chip strain during the heat treatment in IC assembly processes due to the difference between thermal expansion coefficients of the copper frame and silicon chips, respectively.
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