发明名称 BINDER FOR PASTE SOLDER
摘要 PURPOSE:To prevent corrosion of solder powder and oxidation of base metals and to improve brazing workability by mixing polystyrene and org. gelling agent respectively at prescribed % with specific wt.% of n-octane to form the titled binder. CONSTITUTION:The binder for paste solder is obtd. by mixing 40-80% polystyrene, by weight and 0.25-3% org. gelling agent with 20-60% n-octane. mixing and agitating the mixture and heating the same. The sepn. and corrosion of the solder powder during storage are prevented and the oxidation of the base metals when the solder is coated on the base metals is prevented if the paste solder is prepd. by adequately mixing the solder powder and this binder. Since the binder is gelled, the splashing of the binder during soldering and the remaining of residue are obviated. The brazing workability is thereby improved.
申请公布号 JPS63160791(A) 申请公布日期 1988.07.04
申请号 JP19860314062 申请日期 1986.12.24
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 KASHIWAGI KOZO;YANAGISAWA HIDEKAZU
分类号 B23K35/22;C08L25/00 主分类号 B23K35/22
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