发明名称 TARGET FOR SPUTTERING
摘要 PURPOSE:To obtain an efficient target for sputtering by forming the erosion area of a target a high purity material and the other region with a low purity material. CONSTITUTION:The supposed erosion area 2 of a target fixed o a backing plate 3 and the vicinity of the area 2 are formed with a high purity target material 1 and the other region is formed with a low purity target material 4. Thus, an efficient target is obtd. at a low cost.
申请公布号 JPS63161164(A) 申请公布日期 1988.07.04
申请号 JP19860309827 申请日期 1986.12.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 IKEGAMI MASAAKI;KOBAYASHI SHOJI;NAKAMURA MITSUYOSHI;HIRATA KATSUHIRO;OBATA MASANORI;TANAKA EISUKE
分类号 H01L21/285;C23C14/34;H01L21/203 主分类号 H01L21/285
代理机构 代理人
主权项
地址