| 摘要 |
PURPOSE:To bring a wafer into contact with the surface of a suction part incorporating a heater with a uniform pressure, to fix the wafer after correction of its bend and to conduct the heat from the heater efficiently and uniformly by a method wherein the wafer is sucked by means of an electrostatic chuck and the heater is built in the electrostatic chuck. CONSTITUTION:A dielectric body in constructed by coating an insulating layer 6, an electrode 5 and an insulating layer 4 on a metal plate 7. As a heater, e.g. a foil heater 8 is used; this is brought into contact with the reverse face of the dielectric body; a wafer 3 is heated by thermal conduction. A power supply 1 is used to send an electric current to the electrode 5 while a power supply 2 is used to send the electric current to the foil heater 8. By this method, the wafer can be chucked without increasing the number of mechanical and moving parts; because the thermal contact of the wafer with the heater is loose, the temperature distribution becomes uniform and the wafer can be heated up to a high temperature. |
