| 摘要 |
PURPOSE:To mount an IC chip directly on a display substrate and to execute an electrical connection at a low cost and with high productivity by a method wherein a protruding part is formed by a printing method at an edge part or at an intermediate part of a wiring part extended from the inside of the liquid-crystal display substrate. CONSTITUTION:A wiring part 2 on a substrate 1 is formed by a printing method. After that, a pattern to become a protruding part 3 is printed in the same way and is sintered. The height of this protruding part 3 is to range from 5 to 30 mum after the sintering process. After that, the electrode protruding part 3 on a display substrate is aligned with an electrode 8 on an IC substrate 5; after an epoxy resin has been pressed by applying a force of 3 kg in the facing direction of both substrates by means of a jig, it is hardened. The space between the surface of the Al pad 8 on the IC substrate 5 and the surface of the protruding part 3 on the wiring part of the display substrate is adjusted to be 3 mum. By this method, Ni particles 6 contained in a connecting part penetrated into the protruding part and the electric conductivity could be enhanced. Because the height of the protruding part is 5-30 mum, the Ni particles 6 contained in a part other than the connecting part can exist inside the epoxy resin 7 without damaging the IC substrate 5 and the wiring part 2 on the display substrate. |
