| 摘要 |
PURPOSE:To obtain the titled paste outstanding in stress relaxation characteristics preventing ICs from failure, suitable for bonding of large-sized chips to copper frame, by blending silver powder, epoxy resin, curing agent and specific flexibilizer in specified proportions. CONSTITUTION:The objective paste can be obtained by blending (A) silver powder, (B) an epoxy resin, (C) a during agent, and (D) as the flexibilizer, an epoxy group-carrying polybutadiene compound in such weight ratios as A/(B+C+D)=60/40-90/10 and D/(B+C)=0.5/100-20/100.
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