发明名称 |
ELECTRONIC COMPONENT WITH LEAD |
摘要 |
PURPOSE:To assure the electric connection while increasing the fitting strength by a method wherein cavities formed between the grooves at the ends of outer leadpins force-fitted into throughholes and metallic layers on the inner surface of throughholes are filled with conductive bonding agent. CONSTITUTION:Multiple films 2 are coated on the surface of an insulating substrate 1 and inner surface of throughholes 1a while the outer diameter of force-fitted disc type outer leadpins 3 with grooves 3a cut in the long direction thereof is slightly larger than the inner diameter of throughholes 1a of insulating substrate 1. One ends of the outer leadpins 3 are force-fitted into the throughholes 1a of insulating substrate 1 in specified strength and then the cavities formed between the grooves 3a of outer leadpins 3 and the metallic layers 2 on the inner surface of throughholes 1a are filled with conductive bonding agent 7. Through these procesures, the electric connection between the outer leadpins 3 and the metallic layers 2 of insulating substrate 1 can be assured while increasing the fitting strength.
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申请公布号 |
JPS63160261(A) |
申请公布日期 |
1988.07.04 |
申请号 |
JP19860314604 |
申请日期 |
1986.12.23 |
申请人 |
KYOCERA CORP |
发明人 |
NAKAI TAKASHI;TERASAWA MASAMI |
分类号 |
H01G4/228;H01L23/50;H05K3/30 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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