发明名称 ELECTRONIC COMPONENT WITH LEAD
摘要 PURPOSE:To assure the electric connection while increasing the fitting strength by a method wherein cavities formed between the grooves at the ends of outer leadpins force-fitted into throughholes and metallic layers on the inner surface of throughholes are filled with conductive bonding agent. CONSTITUTION:Multiple films 2 are coated on the surface of an insulating substrate 1 and inner surface of throughholes 1a while the outer diameter of force-fitted disc type outer leadpins 3 with grooves 3a cut in the long direction thereof is slightly larger than the inner diameter of throughholes 1a of insulating substrate 1. One ends of the outer leadpins 3 are force-fitted into the throughholes 1a of insulating substrate 1 in specified strength and then the cavities formed between the grooves 3a of outer leadpins 3 and the metallic layers 2 on the inner surface of throughholes 1a are filled with conductive bonding agent 7. Through these procesures, the electric connection between the outer leadpins 3 and the metallic layers 2 of insulating substrate 1 can be assured while increasing the fitting strength.
申请公布号 JPS63160261(A) 申请公布日期 1988.07.04
申请号 JP19860314604 申请日期 1986.12.23
申请人 KYOCERA CORP 发明人 NAKAI TAKASHI;TERASAWA MASAMI
分类号 H01G4/228;H01L23/50;H05K3/30 主分类号 H01G4/228
代理机构 代理人
主权项
地址