| 摘要 |
PURPOSE:To eliminate a part of an adhesive and a protective film after removal of a protective sheet by installing a buffer layer between the adhesive and the protective sheet. CONSTITUTION:A buffer layer 4 is installed between an adhesive 3 and a protective sheet 5. Thanks to this layer, the force which is exerted to a silicon substrate 1 by a grinder 7 is absorbed by the buffer layer 4 between the protective sheet and the adhesive 3; the adhesive 3 does not adhere excessively to a protective film 2; as a result, the adhesive 3 is not deteriorated or hardened. Accordingly, when the protective sheet 5 is stripped together with the buffer layer 4 after completion of a grinding process of the reverse face, a residual substance of the adhesive does not remain on the protective film 2; it is possible to completely remove the protective layer from the semiconductor substrate 1 if the protective film 2 is removed by an ashing process using a gas of oxygen or the like.
|
