| 摘要 |
PURPOSE:To maintain the product quality at a desired level with stability by a method wherein a Ti-Ni-Au barrier layer is provided on both sides of an Si submount and the barrier is covered by a solder layer. CONSTITUTION:On both sides of an Si conductive submount 2, a 500Angstrom -thick Ti first layer 31, a 1500Angstrom -thick Ni second layer 32, and a 500Angstrom -thick Au third layer 33, are formed by spattering, for the construction of a barrier layer 3. The entire surface of the barrier layer 3 is covered by an Sn solder coating. With the layers 31 and 32 in the buffer layer 3 preventing the spread of Si over the surface, there will be no Si oxide formed on the surface. This dispenses with a washing in an inorganic solvent during the packaging process and a product of this design may be stored in the ambient atmosphere. This design keeps stable the quality of products in storage. |
