发明名称 INSPECTING METHOD OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To eliminate the erroneously scratch a proper semiconductor device by transferring the discriminated result of the propriety of the device to other device which does not belong to an inspecting device and marking the discriminated result of the propriety in the other device. CONSTITUTION:The inspected result of a semiconductor device outputted from an inspecting device 12 of the semiconductor device is stored in a memory 9 of a marking device 13 which is different from the inspecting device. A semiconductor wafer which is finished to be inspected is fed to the marking device 13, and marked by a marking unit 11 of the marking device in response to the inspecting result signal outputted from an output unit 10. Since the semiconductor device is thus marked at a time interval after the semiconductor device is inspected, reinspection can be performed if a trouble is further discovered during the time interval, it can eliminate to erroneously scratch the proper semiconductor device.
申请公布号 JPS59144144(A) 申请公布日期 1984.08.18
申请号 JP19830019212 申请日期 1983.02.08
申请人 NIPPON DENKI KK 发明人 HONMA MICHIO
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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