| 摘要 |
PURPOSE:To obtain the title insulating resin paste which is freed of a problem of slanting of a semiconductor element in bonding the semiconductor to external electrodes, by mixing a silica filler containing an ultrafine silica powder with a combination of a phenol novolak resin with a latent amine compound as a curing agent and a normally liquid epoxy resin. CONSTITUTION:A composition containing 5-30wt% silica filler which is a mixture of a silica powder of a max. particle diameter <=50mum and an average particle diameter of 2-5mum with an ultrafine silica powder of an average particle diameter of 0.005-0.02mum and contains 60-85wt% said silica powder of an average particle diameter of 2-5mum, a phenol novolak, a latent amine compound and a normally liquid epoxy resin of a hydrolyzable chlorine content >=500ppm.
|
