| 摘要 |
PURPOSE:To obtain an insulating resin paste of one-pack type, which can be cured at low temperature, has a long pot life and can be used in substrates, electronic components, etc. not sufficiently heat-resistant, by mixing an amorphous silica powder with a guanamine compound and an epoxy resin. CONSTITUTION:An insulating resin paste comprising 40-60pts.wt. amorphous silica powder (A) of an average particle diameter of 1-20mu and a max. particle diameter <=50mu, 2-30pts.wt. guanamine compound (B) of the formula (wherein R is an aliphatic, aromatic or imidazole group), e.g., benzoguanamine, and 20-50pts.wt. epoxy resin (C) of a weight-average MW of 200-500 and a chlorine content <=500ppm. Conventional insulating pastes are chiefly those which are cured at 150-400 deg.C, and are disadvantageous in that those of one-pack type cannot be applied to insufficiently heat-resistant materials such as organic substrates, because they are cured at high temperatures though they can be easily handled and on the other hand, those of low-temperature curability are of two-pack type and therefore mixing is laborious, and their pot lives are short. By the addition of said component B, the composition of one-pack type can be cured at 90-120 deg.C, has a long pot life and can be very easily handled.
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