摘要 |
A cooling device for electronic components connected to a printed circuit board (PCB) by holders comprising a heat-conductive body placed between the component and the PCB and engaging them. Heat is transferred to the PCB in this way, the PCB thus being used as a cooling system for the electronic components. The PCB may be provided with a metallic layer at its engagement surface with the heat-conductive body, or a recess can be made in the PCB so that the heat-conductive body comes into contact with a metal layer embedded in the PCB. The heat-conductive body may be firmly connected to the PCB by gluing or soldering and be connected to the holder by projections. |