发明名称 INSPECTION DEVICE FOR SEMICONDUCTOR
摘要 PURPOSE:To obtain a device capable of executing the decrease of operators, the improvement of reliability on quality, early feedback to a bonding device, statistic quality control by the storage of inspection data, etc., by lighting bonding wires with wedge-shaped luminous flux, detecting the coordinates of the wires from a picture, in which the bonding wires are input as pictures, and comparing relative positions among the wires and normal coordinates. CONSTITUTION:A half mirror 14 is arranged among bonding wires 13 and a camera 11. Wedge-shaped luminous flux 21 is obtained by a lighting section 15 disposed near the bonding wires 13. When the bonding wires 2, 3 are irradiated with wedge-shaped luminous flux 1, one parts 4, 5 of the bonding wires are input as pictures in a shape 4' and a shape 5' to beams and a camera. Data from the camera 11 are transmitted over a memory as a binary picture through a binary-coded circuit. The coordinates of the wires are detected by the binary picture, and defective or nondefective wire shapes are specified by comparing relative positions among the wires and normal coordinates.
申请公布号 JPS63158847(A) 申请公布日期 1988.07.01
申请号 JP19860305355 申请日期 1986.12.23
申请人 TOSHIBA CORP 发明人 UCHIDA FUMIAKI
分类号 H01L21/66 主分类号 H01L21/66
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