| 摘要 |
PURPOSE:To reduce defective appearance by providing a columnar protrusion to one part of the base section of a slot, into which an unsealed semiconductor device is set, and making the temperature distribution of upper and lower electrodes uniform by equalizing a contact area with the lower electrode to the contact areas of the upper electrode and a weight. CONSTITUTION:A lower-electrode receiving protrusion 5 having an upper surface area equal to a contact section area with an upper electrode of a weight 4 is formed to the base of a slot 2 in a lower jig 1. In a sealing process by such a sealing jig, the temperature of an upper jig 3 is elevated at the same time as the lower jig 1, and a glass section 9 is melted by the heat of the upper jig 3. Load is applied to the upper electrode 7 by the weight 4 at that time, and the pressure welding of the upper and lower electrodes 7, 6 and a semiconductor element 8 is ensured. The height of the lower-electrode receiving protrusion 5 for the lower jig is designed so as to be brought to the same extent as the quantity of heat to the upper jig from the weight 4 at that time, thus shaping the symmetric distribution of the quantity of heat transferred to the upper and lower electrodes from the upper and lower jigs, then forming the shape of the melting of the glass section 9 to the same shape of the upper and lower end symmetry of the glass section 9.
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