| 摘要 |
PURPOSE:To enable only a thin film on one side of a semiconductor substrate to be decomposed efficiently, by vaporizing hydrofluoric acid solution within a sealed container and exposing to the vapor only one side of the semiconductor substrate arranged horizontally. CONSTITUTION:Each wafer 16 is disposed on a wafer support 15 with the surface to be decomposed on the upside. The wafer supports 15 are recieved in a rack 13 by sliding them along grooves 12. The rack 13 receiving the wafer supports 15 carrying the wafers 16 is disposed within a sealed container 1. A beaker 3 within the container 1 is filled with hydrofluoric acid 2 and the cover 1a of the container 1 is closed to seal up the container. After several hours at room temperature, the sealed container 1 is filled with vaporized hydrofluoric acid 2. The vapor of hydrofluoric acid 2 enters into the rack 13 from gaps of the rack and is brought into contact with the top face of each of the wafers 16, whereby a thin film on this top face is decomposed. Since only one side of the wafer is exposed to the vapor of hydrofluoric acid and only the thin film on said one side of the wafer is decomposed, there is no need of collecting decomposing solution, unlike conventional methods. Accordingly, the period of time required up to the decomposition can be decreased substantially.
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