| 摘要 |
<p>In the process described, the panel (1) consists of layers (3, 4) of which at least one (3) has been cross-sectionally weakened and bevelled and, after flexural distorsion, is joined to the other layer (4) by bonding and compression techniques. The cross-sectional weakening of at least one layer (3, 4) is produced by forming, by chip-removal, of grooves (5) parallel to one another; the intermediate parts (6) are, at the point where the panel (1) has to have weakened walls (2), bevelled by chip removal at a specified angle.</p> |
