| 摘要 |
PURPOSE:To avoid sticking of flakes by providing a wafer holding member which can hold a main surface of a wafer, which is to be treated, downwardly. CONSTITUTION:A bell-jar cover 21 is turned over by 180 deg. by turning a reversal motor 40 to a normal direction and a wafer fitting surface of a table 34 faces upward. At this stage, a wafer 33 is fixed by a pin 42 and a lever 43. Then the bell-jar cover 21 is turned over by 180 deg. to the opposite direction by turning the reversal motor 40 to a reverse direction so that the wafer fitting surface of the table 34 faced downward. Then the table 34 and the wafer 33 are heated by a heater 35. After that, the table 34 is rotated at a slow speed by rotating a motor 30 and a silicon film is formed on the surface of the wafer 33 by generating plasma. After the silicon film is formed for a prescribed time, supply of reaction gas, application of voltage and the rotation of the table are stopped and then a bell-jar body 1 is descended. Then, the bell-jar cover 21 is turned over again by 180 deg. and the wafer 33 is removed from the table 34. |
