发明名称 COOLING STRUCTURE OF INTEGRATED CIRCUIT
摘要 PURPOSE:To make exchange of IC easy, and prevent damage of IC, by providing a cold plate and a holding part fixed on an IC case with a pinching part to pinch a cooling pipe in the direction parpendicular to a heat dissipation surface. CONSTITUTION:A cold plate 11 and a holding member 12 are fixed to an IC case 2 by screwing a fixed screw 15 into a screw hole 16, and a cooling pipe 17 is arranged between pinching parts 11a and 12a. The heat generated from an IC in the case 2 is transmitted from the case 2 to the pipe 17 through the plate 11 and the member 12, and is dissipated into a refeigerant flowing in the pipe 17. By taking off the screw 15, the plate 11 and the member 12 can be removed from the case 2 together with the pipe 17. As the pinching parts 11a and 12a are protruded in the direction perpendicular to the heat dissipation surface 3 of the case 2, even if each case 2 has height difference in mounting on a wiring boad 1, this difference is absorbed in a height h, so that pinching is performed without applying stress to the case 2 or the pipe 17.
申请公布号 JPS63157449(A) 申请公布日期 1988.06.30
申请号 JP19860303809 申请日期 1986.12.22
申请人 NEC CORP 发明人 MARUYAMA KAZUO
分类号 H01L23/40;H01L23/473 主分类号 H01L23/40
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